Solder fused interconnections in multilayer circuits
A new solder fusion process has been developed for production of multi-layer cables and multilayer printed wiring boards. The multilayer process consists of three steps: (1) the photo-etching fabrication of the basic flexcircuit, (2) the lamination bonding of several flexcircuit layers together, and (3) solder fusion interjoining of the exposed lands to provide electrical continuity. Solder fusion is the unique feature of the process. In the solder fusion process the multilayer assembly is never in contact with highly reactive chemicals which, if entrapped, can lead to corrosion and dielectric breakdown of the assembly. Accurate layer to layer registration can be accomplished with the solder fusion process. A multilayer assembly produced by solder fusion can be shaped into three-dimensional configurations. The repeatable electrical continuity of solder fused interconnections in multilayer assemblies has been confirmed by microhm resistance testing. The solder fused multilayer assembly can be used very advantageously in highly sophisticated instruments and apparatus where portability, weight, bulk, environmental stability, and high reliability are critical requirements.
- Research Organization:
- Sandia Labs., Albuquerque, N.Mex. (USA)
- DOE Contract Number:
- E(29-1)-789
- OSTI ID:
- 5278147
- Report Number(s):
- SAND-77-0197
- Country of Publication:
- United States
- Language:
- English
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