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Title: The effect of hydrogen dilution on the hot-wire deposition of microcrystalline silicon

Book ·
OSTI ID:527648
; ; ;  [1]
  1. Univ. Stuttgart (Germany). Inst. fuer Physikalische Elektronik

The HWCVD technique is a very promising method for solar cell or thin film transistor (TFT) applications. The growth of amorphous (a-Si:H) and microcrystalline ({micro}c-Si) silicon by hot-wire chemical vapor deposition (HWCVD) has been studied by combining in-situ ellipsometry, atomic force microscopy (AFM), and Raman spectroscopy. Generally a dense nucleation layer is formed during a-Si:H HWCVD, containing nuclei about 0.8 nm high and 10 to 20 nm in diameter. The surface roughness gradually increases with film thickness and settles at a root mean square (RMS) value of 1.6 nm at about 200 nm thickness. For hydrogen dilution at gas flow ratios x = [H{sub 2}]/[SiH{sub 4}] of 15 to 120 microcrystalline material was obtained. The grain size and nucleation layer, however, are strongly dependent on x. Low H{sub 2} dilution enhances the formation of an amorphous-like interface layer from which the {micro}c-Si:H growth eventually starts. Increasing x promotes the etching of amorphous regions and the surface diffusion of precursors, resulting in larger nuclei. x = 30 yields extended {micro}c-Si nuclei (30 nm height, 90 nm diameter) and a pronounced increase in surface roughness for thicker films, but suppresses the formation of the amorphous-like nucleation layer. A further increase in x remarkably lowers the growth rate, but smoother surfaces at comparable film thickness and larger lateral dimensions of the grains occur. This is interpreted as incipient etching of the crystallites.

OSTI ID:
527648
Report Number(s):
CONF-960401-; ISBN 1-55899-323-1; TRN: IM9741%%76
Resource Relation:
Conference: Spring meeting of the Materials Research Society (MRS), San Francisco, CA (United States), 8-12 Apr 1996; Other Information: PBD: 1996; Related Information: Is Part Of Amorphous silicon technology -- 1996; Hack, M. [ed.] [dpiX, Palo Alto, CA (United States)]; Schiff, E.A. [ed.] [Syracuse Univ., NY (United States)]; Wagner, S. [ed.] [Princeton Univ., NJ (United States)]; Schropp, R. [ed.] [Utrecht Univ. (Netherlands)]; Matsuda, Akihisa [ed.] [Electrotechnical Lab., Tsukuba (Japan)]; PB: 929 p.; Materials Research Society symposium proceedings, Volume 420
Country of Publication:
United States
Language:
English