Low thermal coefficient of expansion printed wiring boards
Production processes have been established and the reliability has been successfully proven for multilayer printed wiring boards manufactured from polyimide/quartz laminates. The polyimide/quartz is a construction of polymide resin reinforced with quartz fabric. The polymide/quartz has a lower thermal coefficient of expansion (TCE) in the X-Y plane at 9-10 ppm/{degrees}C than standard production laminates (polymide/glass and epoxy/glass) at 15--16 ppm/{degrees}C and is intended for use in conjunction with surface mount devices (SMD). The lower TCE of polymide/quartz provides a closer match to the TCE of the SMD, thereby reducing thermal stresses during temperature cycling. Surface mount technology is being used in the current programs with future applications now being considered.
- Research Organization:
- Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
- Sponsoring Organization:
- USDOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5273900
- Report Number(s):
- KCP-613-4748; ON: DE92013704
- Country of Publication:
- United States
- Language:
- English
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Vacuum multilayer lamination of printed wiring boards
Vacuum multilayer lamination of printed wiring boards
Related Subjects
36 MATERIALS SCIENCE
IMIDES
THERMAL EXPANSION
PRINTED CIRCUITS
FABRICATION
DRILLING
PROGRESS REPORT
QUARTZ
THERMODYNAMIC PROPERTIES
DOCUMENT TYPES
ELECTRONIC CIRCUITS
EXPANSION
MINERALS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
OXIDE MINERALS
PHYSICAL PROPERTIES
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)
360606 - Other Materials- Physical Properties- (1992-)