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Reduction of secondary defect formation in MeV B sup + ion-implanted Si (100)

Journal Article · · Applied Physics Letters; (USA)
DOI:https://doi.org/10.1063/1.102181· OSTI ID:5263084
; ; ;  [1]; ; ;  [2]
  1. Institute of Low Energy Nuclear Physics, Beijing Normal University, Beijing 100 875, People's Republic of China (CN)
  2. FOM Institute for Atomic and Molecular Physics, Kruislaan 407, 1098 SJ Amsterdam, The Netherlands

MeV ion implantation in Si above a dose of 10{sup 14}/cm{sup 2} leads to secondary defect formation in a buried layer, which is rather stable. Annealing of Si(100) implanted with 2.0 MeV B{sup +} ions to a dose of 2.2{times}10{sup 14}/cm{sup 2} has been investigated by means of cross-sectional transmission electron microscopy. After annealing at 900 {degree}C for 15 min, dislocation loops elongated along (110) were found. A remarkable decrease in secondary defect formation has been observed if, in addition, 140 keV Si{sup +} was implanted prior to annealing.

OSTI ID:
5263084
Journal Information:
Applied Physics Letters; (USA), Journal Name: Applied Physics Letters; (USA) Vol. 55:18; ISSN APPLA; ISSN 0003-6951
Country of Publication:
United States
Language:
English