New ultralow permittivity composites for use in ceramic packaging of ga:as integrated circuits. Annual report, 1 August 1984-31 July 1985
This report documents work performed to develop materials systems for use in the ceramic packaging of Ga:As integrated circuits. Topics under study at Penn State are: dielectrics produced from Macro-Defect-Free (MDF) cements. Both aluminate- and silicate-based cements were studied. The objectives of the first year's work have been to show that suitable test tablets can be produced that exhibit dielectric losses less than 1% into the frequency range of 2.5 GHz. Current work is focused upon lowering the permittivity level using silica microballoons dispersed in the matrix. Sol-gel preparation of both thick (25 microns) and thin (0.5 microns) SiO2 and silica:alumina films has shown that in the diphasis system, it is possible to produce crack-free monoliths with permittivities in the range 1.6 to 2.0 and loss tangents below .003. In the thin films, capping of columnar sputtered etched films was demonstrated. For etched Schott and Vycor glass structures, permittivities in the range 2.5 to 3.0 was measured with excellent low-loss properties. Sputtered silicon films were sucessfully etched to yield highly planar columnar structures up to 25 microns thick. Experiments are in progress to convert the silicon to SiO/sub 2/ by an oxidation step, and capping of the columnar structure using sol-gel coatings was achieved. In a parallel program at Interamics, new families of borosilicate-glass-bonded alumina ceramics are being developed. Tapes using both lead and calcium boroslicate glasses were fabricated and densified at firing temperature below 1,000 C. Current studies are exploring suitable metallization techniques.
- Research Organization:
- Pennsylvania State Univ., University Park (USA). Materials Research Lab.
- OSTI ID:
- 5192350
- Report Number(s):
- AD-A-168877/9/XAB
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
COMPOSITE MATERIALS
FABRICATION
PERMITTIVITY
INTEGRATED CIRCUITS
PACKAGING
CALCIUM
CEMENTS
ETCHING
FILMS
GLASS
LOSSES
MATRIX MATERIALS
OXIDATION
SILICATES
SILICON
SILICON OXIDES
ALKALINE EARTH METALS
BUILDING MATERIALS
CHALCOGENIDES
CHEMICAL REACTIONS
ELECTRONIC CIRCUITS
ELEMENTS
MATERIALS
METALS
MICROELECTRONIC CIRCUITS
OXIDES
OXYGEN COMPOUNDS
SEMIMETALS
SILICON COMPOUNDS
SURFACE FINISHING
990200* - Mathematics & Computers
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