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Elimination of end-of-range and mask edge lateral damage in Ge/sup +/ preamorphized, B/sup +/ implanted Si

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.97382· OSTI ID:5190419
The problems of residual extended defects due to end-of-range ion implantation damage and mask edge lateral damage have been solved in this study for shallow boron junctions preamorphized via germanium ion implantation. Defect elimination has been achieved by adjusting the germanium ion energy, dose, and annealing temperature and ambient to minimize the local interstitial point defect concentration and optimize the role of the free surface in defect annihilation. For the combination of shallow, low dose 40 or 60 keV/2 x 10/sup 14/ cm/sup -2/ Ge/sup +/ and 8 keV/1 x 10/sup 15/ cm/sup -2/ B/sup +/ implants, a defect-free structure was obtained following a 1050 /sup 0/C, 10 s rapid thermal anneal (RTA) in a nonoxidizing Ar ambient. For these samples, boron profiles determined using secondary ion mass spectroscopy (SIMS) showed the junction depth to be approximately 0.17 ..mu..m at a background doping of 1 x 10/sup 17/ cm/sup -3/ with a sheet resistance of 136 ..cap omega../D'Alembertian.
Research Organization:
Materials Engineering Department, North Carolina State University, Raleigh, North Carolina 27695-7916
OSTI ID:
5190419
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 49:19; ISSN APPLA
Country of Publication:
United States
Language:
English