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U.S. Department of Energy
Office of Scientific and Technical Information

Prospects for printing very-large-scale integrated circuits with masked ion-beam lithography

Technical Report ·
OSTI ID:5100423

Ions hold a number of advantages over uv photons, x-ray photons, and electrons when used for high-resolution printing. Masked ion beam lithography (MIBL) has demonstrated many of the requirements of a very large scale integrated (VLSI) lithographic tool. Some of the different approaches to MIBL and their advantages will be discussed.

Research Organization:
Massachusetts Inst. of Tech., Lexington (USA). Lincoln Lab.
OSTI ID:
5100423
Report Number(s):
AD-A-170467/5/XAB; MS-6952
Country of Publication:
United States
Language:
English

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