Adhesion assessment of copper thin films
- Univ. of Minnesota, Minneapolis, MN (United States). Dept. of Chemical Engineering
- Sandia National Labs., Livermore, CA (United States)
Nano-indentation testing has been used to quantitatively assess the adhesion of thin copper films, sputtered to thicknesses of 150 nm to 1500 nm. Copper films of low residual stress were deposited via RF diode cathode sputtering onto SiO{sub 2}/Si substrates. Overlayers of DC magnetron sputtered tungsten, 850 nm thick with high residual stress, were additionally used to provide a driving force for delamination. All films tested exhibited buckle-driven delamination, from which the interfacial toughness was estimated to be 0.2 - 2 J/m{sup 2}, which is comparable to the thermodynamic work of adhesion. The use of an overlayer requires extensions of existing models, but otherwise does not change the interfacial adhesion, allowing measurements of films that would not otherwise delaminate.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE Office of Energy Research, Washington, DC (United States); National Science Foundation, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 486050
- Report Number(s):
- SAND--97-8572C; CONF-970302--13; ON: DE97052748; CNN: Grant NSF/CR-8721551
- Country of Publication:
- United States
- Language:
- English
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