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Characterization of Reillex{trademark} HPQ Polymer

Technical Report ·
DOI:https://doi.org/10.2172/4843· OSTI ID:4843
This work examined the thermal stability of Reillex(tm) HPQ resin as part of a comprehensive plan to qualify that material for use in HB-line. No low temperature exothermic reactions or volatile organic compounds occurred in various lots of as-received, chloride form Reillex(tm) HPQ polymer or the nitrate form polymer. The studies do not suggest any restrictions on purchase criteria for the resin nor any changes in planned use. Previously observed low temperature exotherms resulted from reaction of nitric acid with the aluminum sample holders used in the Differential Scanning Calorimetry analysis.
Research Organization:
Savannah River Site (US)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
AC09-96SR18500
OSTI ID:
4843
Report Number(s):
WSRC-TR-98-00231, Rev. 0
Country of Publication:
United States
Language:
English

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