RIGID FORMS AS VERSATILE PROTECTION FOR COMPONENTRY AGAINST HIGH "G" SHOCK
Presented at Regional Technical Conference on Plastic Foams, Society of Plastics Engineers, Buffalo, New York, October 1961. A method of protecting modular electronic subassemblies against mechanical shock up to several thousand G is described. The components are supported with urethane foam spacers which are either machined or molded to fit the component external contour. (J.R.D.)
- Research Organization:
- Sandia Corp., Albuquerque, N. Mex.
- Sponsoring Organization:
- US Atomic Energy Commission (AEC)
- DOE Contract Number:
- AT(29-1)-789
- NSA Number:
- NSA-16-000344
- OSTI ID:
- 4833802
- Report Number(s):
- SCR-447
- Country of Publication:
- United States
- Language:
- English
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