Improved bondability of molded rigid urethane form by plasma treatment

Technical Report · Sun Jan 01 04:00:00 EST 1978

DOI:https://doi.org/10.2172/5153852· OSTI ID:5153852

DeGisi, S L; Smith, C H

Most mold releases, including so-called nontransferring releases, interfere with bonding of molded urethane foam. Water-washable mold releases are not readily removable from urethane foams cured at elevated temperatures. Plasma treatment in either argon or oxygen improves the bonding surfaces of molded urethane foam. Comparable bonding results can be obtained with RF (13.6 MHz), AC (20 kHz), or DC-plasma treatments. The plasma-treated foam surfaces will retain the improved bondability for a considerable length of time. Plasma treatment is effective for epoxy and RTV silicone adhesives. A primer recommended for metal bonding with RTV silicone, together with plasma treatment, produces superior bondability of molded urethane foam parts.

• Research Organization: Bendix Corp., Kansas City, Mo. (USA)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 5153852
• Report Number(s): BDX-613-1915
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360301* -- Composite Materials-- Preparation & Fabrication-- (-1987)
BONDING
CARBAMATES
CARBONIC ACID DERIVATIVES
CARBOXYLIC ACID SALTS
CASTING MOLDS
COLLOIDS
DISPERSIONS
FABRICATION
FOAMS
JOINING
MOLDING
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
SURFACE TREATMENTS
URETHANE