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U.S. Department of Energy
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DEVELOPMENT OF HIGH-TEMPERATURE STRAIN-GAGE BONDING MATERIALS CURABLE AT LOW TEMPERATURES

Technical Report ·
OSTI ID:4826264
Compositions were prepared which meet the objectives for the program for development of strain-gage bonding materials curable at low temperatures. A low- temperature formulation of tubular alumina in a potassium silicate sol with suspending agent will cure to a high degree below 200 deg F if presealed with silicone between air setting and heating, and is electrically serviceable to 800 deg F. A hightemperature composition, designated formulation B52, based on the monoaluminum dihydrogen phosphate-silica mixture, but with chromic anhydride and alumina hydrate additions, cures adequately at 400 deg F or below and is usefal above the limiting service temperature of present strain-gage alloys, 1600 deg F. Both cement types display good resistance to thermal shock and repeated rapid cycling. They are also adequately strong for normal strain transmission purposes. The low-temperature cement is mechanically stronger at all temperatures. Differential thermal analyses verified curing temperatures and suggest the possibility of low-temperature vacuum curing of phosphoric acid compositions. (auth)
Research Organization:
Illinois Inst. of Tech., Chicago. Armour Research Foundation
NSA Number:
NSA-16-022591
OSTI ID:
4826264
Report Number(s):
NAMC-ASL-1050(Pt.IV); NAVAIRMA
Country of Publication:
United States
Language:
English