Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu{sub 6}Sn{sub 5} thin film diffusion couples

Book · Tue Dec 31 04:00:00 EST 1996

OSTI ID:479282

Neils, W K; Chromik, R R; Dreyer, K F; Grosman, D; Cotts, E J ^[1]

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1. Binghamton Univ., NY (United States). Physics Dept.

As dimensions in electronic packages decrease, the importance of characterizing interdiffusion in solder/metal couples on a submicron length scale increases. The authors find differential scanning calorimetry to be suitable for the characterization of the energetics and kinetics of interdiffusion in solder/metal diffusion couples. Differential scanning calorimetry studies of interdiffusion in Cu/Cu{sub 6}Sn{sub 5} diffusion couples have shown that the driving force for interdiffusion is similar for thin film composites and for bulk diffusion couples. The heat of formation of Cu{sub 3}Sn from Cu{sub 6}Sn{sub 5} and Cu thin films was found to be {Delta}H{sub r} = {minus}4.3 {+-} 0.3 kJ/mol. Portions of the differential scanning calorimetry scans are identified with diffusion limited growth of Cu{sub 3}Sn. From these calorimetry data they have estimated {tilde D}(cm{sup 2}/s) = D{sub {omicron}} exp({minus}E/k{sub b}T), where k{sub b} is Boltzmann`s constant, D{sub {omicron}} = 3.2 {times} 10{sup {minus}2} cm{sup 2}/s, and E = 0.87 eV/atom.

• Sponsoring Organization: National Science Foundation, Washington, DC (United States)
• OSTI ID: 479282
• Report Number(s): CONF-951155--; ISBN 1-55899-301-0
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING
CALORIMETRY
COPPER
COPPER ALLOYS
ELECTRONIC EQUIPMENT
EXPERIMENTAL DATA
INTERMETALLIC COMPOUNDS
NUCLEATION
REACTION HEAT
SELF-DIFFUSION
THERMODYNAMICS
THIN FILMS
TIN ALLOYS