CLADDING UO$sub 2$ WITH BERYLLIUM BY GAS-PRESSURE BONDING
Contamination-free beryllium-to-beryllium bonds were achieved by gas- pressure bonding at 1550 to 1650 deg F for 4 hr at 10,000 psi. Bonds produced with grit-blasted surfaces exhibited up to 50 per cent grain growth across the interface while those produced by shapering showed less grain growth. Although all of the beryllium-clad UO/sub 2/ fuel elements prepared possessed cracks in the cladding, the feasibility of this materials combination was proven by the bonds obtained between all of the beryllium components. The cracks appeared to be a result of reaction with the spacer material used in the bonding container rather than because of the inherent properties of beryllium or any of the fabricating procedures. (auth)
- Research Organization:
- Battelle Memorial Inst., Columbus, Ohio
- DOE Contract Number:
- W-7405-ENG-92
- NSA Number:
- NSA-17-003440
- OSTI ID:
- 4760342
- Report Number(s):
- BMI-1602
- Resource Relation:
- Other Information: Orig. Receipt Date: 31-DEC-63
- Country of Publication:
- United States
- Language:
- English
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