Computational continuum modeling of solder interconnects: Applications

Conference · Tue Apr 01 04:00:00 EST 1997

OSTI ID:471390

Burchett, S N; Neilsen, M K; Frear, D R

The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Fb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder, which is currently under development, was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of a mini ball grid array solder interconnect. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the thermomechanical response of a mini ball grid array solder interconnects then will be presented.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 471390
• Report Number(s): SAND--97-0672C; CONF-970616--7; ON: DE97004032
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
99 GENERAL AND MISCELLANEOUS
DEFORMATION
ELECTRONIC CIRCUITS
LEAD ALLOYS
MATHEMATICAL MODELS
MICROSTRUCTURE
SOLDERED JOINTS
SOLDERING
THERMAL ANALYSIS
TIN BASE ALLOYS