Fabrication of nickel microbump on aluminum using electroless nickel plating

Journal Article · Sat Feb 01 04:00:00 EST 1997 · Journal of the Electrochemical Society

DOI:https://doi.org/10.1149/1.1837434· OSTI ID:465091

Watanabe, H; Honma, H ^[1]

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1. Kanto Gakuin Univ., Yokohama, Kanagawa (Japan). Faculty of Engineering

Fabrication of nickel microbumps on an aluminum electrode using a nickel displacement and a direct nickel plating process was investigated. Electroless nickel plating reaction with hypophosphite as a reducing agent was not initiated on the aluminum substrate, because aluminum does not have catalytic action on the oxidation of hypophosphite. Accordingly, nickel was initially deposited on the aluminum using nickel displacement plating for the initiation of the electroless plating. Nickel bumps on the aluminum electrode were fabricated by treatment of the nickel displacement plating followed by electroless nickel plating. Nickel microbumps also can be formed on the aluminum electrode without the displacement plating process. Activation of the aluminum surface is an indispensable process to initiate electroless nickel plating. Uniform bumps 20 {micro}m wide and 15 {micro}m high with good configuration were obtained by direct nickel plating after being activated with dimethyl amine borane.

• Sponsoring Organization: USDOE
• OSTI ID: 465091
• Journal Information: Journal of the Electrochemical Society, Journal Name: Journal of the Electrochemical Society Journal Issue: 2 Vol. 144; ISSN 0013-4651; ISSN JESOAN
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM
CONNECTORS
ELECTRODEPOSITED COATINGS
ELECTROPLATING
INTEGRATED CIRCUITS
MORPHOLOGY
NICKEL