FOULING IN ORGANIC-COOLED SYSTEMS
Technical Report
·
OSTI ID:4631967
Studies of organic coolants in the out-reactor 250-0-1 loop and in the in-reactor X-7 loop showed that fouling films are deposited on heat-transfer surfaces by two mechanisms, one involving soluble impurities and the other insoluble impurities in the coolant. The simultaneous action of two mechanisms of deposition can lead to a wide variety of compositions and structures of the deposited film. The concentration of impurities is the most important factor controlling the deposition rate. Coolant velocity and surface temperature also have major effects on the fouling rate. At low chlorine levels continuous coolant cleanup through Attapulgus clay was shown to reduce deposition rates under representative reactor conditions from 100 to 1 mu g/cm/sup 2/ hr. Chlorine, which is a strong promoter of fouling, is not removed by Attapulgus clay. An acceptable deposition rate of 0.3 mu g/cm/sup 2/ hr should be achieved by intensive purification, coupled with the exclusion of impurities such as chlorine. (auth)
- Research Organization:
- Atomic Energy of Canada Ltd., Chalk River, Ontario (Canada)
- NSA Number:
- NSA-17-036863
- OSTI ID:
- 4631967
- Report Number(s):
- CRCE-1096; AECL-1761
- Country of Publication:
- Canada
- Language:
- English
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