Experimental investigation of interfacial heat transfer for molten metal solidification on a substrate
- Univ. of California, Santa Barbara, CA (United States). Dept. of Mechanical and Environmental Engineering
Thermal contact at the melt/substrate interface is an important issue in many material processes such as mold casting, strip and slab casting, splat cooling, melt-spinning, spray deposition, etc. In all these processes, the molten metal is brought in contact with a colder substrate, and the heat is transferred from the melt into this substrate. Here, experiments have been conducted to quantify the interfacial heat transfer between molten copper and a cold metallic substrate, and in particular to investigate the heat transfer variation as the initial liquid/solid contact becomes a solid/solid contact after nucleation. A high heat transfer coefficient (ranging from 10{sup 4} to 10{sup 5} W/m{sup 2}K) during the earlier liquid cooling phase and a lower heat transfer coefficient (from 10{sup 3} to 10{sup 4} W/m{sup 2}K) during the subsequent solid splat cooling phase were estimated through matching of model calculations and measured temperature history of the sample. The dynamic variations in the interfacial heat transfer resulting from the solidification process were quantified for splat cooling and were found to be affected by the melt superheat, the substrate material, and the substrate surface finish.
- Sponsoring Organization:
- National Science Foundation, Washington, DC (United States)
- OSTI ID:
- 462604
- Report Number(s):
- CONF-950828--; ISBN 0-7918-1705-9
- Country of Publication:
- United States
- Language:
- English
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