The effect of heat transfer coefficient on thermal residual stresses in spray deposited materials
- Univ. of California, Irvine, CA (United States). Chemical Engineering and Materials Science
In many rapid solidification processes, such as splat cooling, melt-spinning, and spray atomization and deposition, the transfer of thermal energy from the melt or deposited material to a cold substrate is very important, because it determines cooling rate, which in turn determines the properties of the fabricated materials. It is, therefore, essential to understand and quantify the thermal interaction between a melt or deposited material and a substrate during melt spreading and cooling, melt solidification, and solid cooling. The thermal contact is generally quantified by a heat transfer coefficient h, which is defined as the ratio of heat flux over the temperature difference across the interface between the melt or deposited material and the substrate. Since the cooling rate of a melt or deposited material during processing is a direct function of h, the residual stresses that develop in the fabricated material are expected to be influenced significantly by the variation of h. However, most recent studies of thermal residual stresses in deposited materials assumed a constant value of h for their modeling. Therefore, the objective of the present study is to investigate the effect of heat transfer coefficient variation on thermal residual stresses in a spray deposited material using thermo-elastoplastic finite element method.
- Sponsoring Organization:
- National Science Foundation, Washington, DC (United States); Department of the Army, Washington, DC (United States); California Univ., Berkeley, CA (United States)
- OSTI ID:
- 438604
- Journal Information:
- Scripta Materialia, Journal Name: Scripta Materialia Journal Issue: 3 Vol. 36; ISSN 1359-6462; ISSN SCMAF7
- Country of Publication:
- United States
- Language:
- English
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