Transient liquid phase bonding of NiAl using Ni-Si-B interlayers
- Auburn Univ., AL (United States). Materials Engineering Program
This paper examines Transient Liquid Phase (TLP) bonding of NiAl using Ni-Si-B interlayers. The investigation determines the extent to which microstructural development during TLP bonding in the NiAl/Ni-Si-B/NiAl system can be discussed in terms of standard TLP models. The work considers compositional changes induced in the interlayer by dissolution of the substrate and the character of the dissolution process. Subsequent epitaxial growth of nickel-enriched NiAl from the substrate into the joint region and homogenization of the Al content of the NiAl are examined. Breakdown in planarity of the NiAl solidification front is discussed, in particular with regard to implications for the time taken to complete isothermal solidification. The formation of substrate borides as a result of boron redistribution from the joint to the substrates during isothermal solidification and homogenization is examined. Comparison is drawn between the findings of the present investigation and TLP bonding of conventional Ni-base alloys, for which Ni-Si-B interlayers are commonly employed.
- OSTI ID:
- 445286
- Report Number(s):
- CONF-940367--; ISBN 0-87171-441-8
- Country of Publication:
- United States
- Language:
- English
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