Transient liquid-phase bonding in the NiAl/Cu/Ni system -- A microstructural investigation
- Auburn Univ., AL (United States). Materials Research and Education Center
A transmission electron microscopy based investigation of microstructural development in NiAl-Ni transient liquid bonding, using commercial purity copper interlayers, is presented in this article. The article considers the mechanisms of isothermal solidification in NiAl/Cu/Ni joints and the influence of copper diffusion from the joint centerline on the microstructures of the adjacent NiAl and Ni substrates. Changes in the microstructure of the bond centerline due to entry of aluminum (from the NiAl substrate) and Ni (from both the NiAl and the Ni substrates) are discussed. Transfer of aluminum from the NiAl substrate to the Ni substrate is also examined. The precipitation of both L1{sub 2} type {gamma}{prime} and B2 type {beta} phases at the joint centerline is investigated. Precipitation of {gamma}{prime} within both the NiAl and Ni substrates is considered. The formation of Al type {gamma} phases in the NiAl substrate is also examined.
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 413292
- Journal Information:
- Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science, Journal Name: Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science Journal Issue: 11 Vol. 27; ISSN MMTAEB; ISSN 1073-5623
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
AIRCRAFT
ALUMINIUM ALLOYS
BONDING
COMPOSITE MATERIALS
COPPER
DIFFUSION
GAS TURBINE ENGINES
GRAIN SIZE
INTERFACES
INTERMETALLIC COMPOUNDS
LIQUID METALS
METALLOGRAPHY
MICROSTRUCTURE
NICKEL
NICKEL ALLOYS
OPTICAL MICROSCOPY
PRECIPITATION
SAMPLE PREPARATION
SCANNING ELECTRON MICROSCOPY
SOLIDIFICATION