Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Si{sub 3}N{sub 4}/Si/In{sub 0.05}Ga{sub 0.95}As/n{endash}GaAs metal{endash}insulator{endash}semiconductor devices

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.364130· OSTI ID:436402
; ; ; ; ; ;  [1]
  1. Materials Research Laboratory and Coordinated Science Laboratory, University of Illinois at Urbana-Champaign, 104 South Goodwin Avenue, Urbana, Illinois 61801 (United States)

We report a novel metal{endash}insulator{endash}semiconductor (MIS) structure exhibiting a pseudomorphic In{sub 0.05}Ga{sub 0.95}As layer on GaAs with interface state densities in the low 10{sup 11} eV{sup {minus}1}cm{sup {minus}2}. The structure was grown by a combination of molecular beam epitaxy and chemical vapor deposition methods. The hysteresis and frequency dispersion of the MIS capacitor were lower than 100 mV, some of them as low as 30 mV under a field swing of about {plus_minus}1.3 MV/cm. The 150-{Angstrom}-thick In{sub 0.05}Ga{sub 0.95}As channel between Si and GaAs is found to bring about a change in the minority carrier recombination behavior of the GaAs channel, in the same way as done by In{sub 0.53}Ga{sub 0.47}As channel MIS structures. Self-aligned gate depletion mode In{sub 0.05}Ga{sub 0.95}As metal{endash}insulator{endash}semiconductor field-effect transistors having 3 {mu}m gate lengths exhibited field-effect bulk mobility of 1400 cm{sup 2}/Vs and transconductances of about 170 mS/mm. {copyright} {ital 1997 American Institute of Physics.}

Research Organization:
University of Illinois
DOE Contract Number:
FG02-91ER45439
OSTI ID:
436402
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 1 Vol. 81; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English