Microstructure of radio frequency sputtered Ag{sub 1{minus}{ital x}}Si{sub {ital x}} alloys

Journal Article · Mon Jul 01 04:00:00 EDT 1996 · Journal of Vacuum Science and Technology, A

DOI:https://doi.org/10.1116/1.580047· OSTI ID:434648

Leedy, K D; Rigsbee, J M ^[1]

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1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (United States)

A series of thin film Ag{sub 1{minus}{ital x}}Si{sub {ital x}} alloys were fabricated using radio frequency sputter deposition with composite Ag+Si sputter targets and water-cooled and liquid nitrogen{endash}cooled substrate holders. The microstructures of the films were analyzed using x-ray diffraction and transmission electron microscopy. As-deposited films contained fcc Ag and amorphous Si. The Ag grain size decreased as the Si content increased. Films deposited on the liquid nitrogen{endash}cooled substrate holder exhibited grain sizes smaller than films deposited on the water-cooled substrate holder. Despite the negligible Ag and Si mutual solid solubilities, the metastable Ag{sub 3}Si hcp silver silicide phase was observed in addition to fcc Ag and amorphous Si in a 12 at.{percent} Si alloy deposited on the liquid nitrogen{endash}cooled substrate holder. The Ag{sub 3}Si phase observed by x-ray diffraction in 5000-A-thick films was not found in the 250-A-thick TEM films, suggesting a thickness dependence of stability. During vacuum anneals above 100{degree}C, the Ag{sub 3}Si phase partially decomposed. {copyright} {ital 1996 American Vacuum Society}

• OSTI ID: 434648
• Journal Information: Journal of Vacuum Science and Technology, A, Journal Name: Journal of Vacuum Science and Technology, A Journal Issue: 4 Vol. 14; ISSN 0734-2101; ISSN JVTAD6
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
HIGH-FREQUENCY DISCHARGES
MICROSTRUCTURE
SILICON ALLOYS
SILVER ALLOYS
SPUTTERED MATERIALS
THIN FILMS