EFFECT OF IMPURITIES ON THE ELIMINATION OF RETICULAR FAULTS DURING LOW TEMPERATURE ANNEALING OF COLD WORKED ZONE MELTED ALUMINUM

Journal Article · Mon Dec 22 04:00:00 EST 1958 · Compt. rend.

OSTI ID:4252121

Dimitrov, O

It is shown that the decrease of the resistivity preceding recrystallization, during low-temperature annealing of zone-melted aluminum cold- worked at the temperature of liquid nitrogen, is caused by faults whose effect on the mechanical properties is very weak. The elimination of the faults. at a velocity independent of the presence of small quantities of impurities, follows the same law and has the same activation energy as the elimination of lacunes maintained by the tempering of alumainum. The recrystallization is extremely sensitive to very low quantities of impurities. (tr-auth)

• Research Organization: Originating Research Org. not identified
• NSA Number: NSA-13-007787
• OSTI ID: 4252121
• Journal Information: Compt. rend., Journal Name: Compt. rend. Vol. Vol: 247
• Country of Publication: Country unknown/Code not available
• Language: French

Related Subjects

ACTIVATION ENERGY
ALUMINUM
ANNEALING
COLD WORKING
DEFECTS
ELECTRIC CONDUCTIVITY
IMPURITIES
LOW TEMPERATURE
MELTING
METALLURGY AND CERAMICS
RECRYSTALLIZATION
TEMPERING
THERMODYNAMICS