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CUBIC AND OCTAHEDRAL ETCH PITS IN ALUMINIUM

Journal Article · · J. Inst. Metals
OSTI ID:4195510
An etching reagent for aluminum was prepared by the solution of HCl gas in a solvent consisting of 90 wt.% dioxane (C/sub 4/H/sub 8/O/sub 2/) and 10 wt.% water. The reagent was applied to 99.99% Al previously chemically polished in a phosphoric acid/nitric acid mixture at 25 deg C. lf the concentration of HCl was less than 6M, cubic etch pits formed and for concentrations greater than 6M, octahedral etch pits formed. (C.J.G.)
Research Organization:
Coll. of Tech., Birmingham, Eng.
NSA Number:
NSA-14-008475
OSTI ID:
4195510
Journal Information:
J. Inst. Metals, Journal Name: J. Inst. Metals Vol. Vol: 88
Country of Publication:
Country unknown/Code not available
Language:
English

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