THE MECHANISM OF HIGH TEMPERATURE DEFORMATION OF Ni-Al AND Ni-Cu SOLID SOLUTIONS

Journal Article · Mon Jun 01 04:00:00 EDT 1959 · Fiz. Metal. i Metalloved

OSTI ID:4195306

Syutkina, V I; Yakovleva, E S

Tests were carried oui on the tensile deformation of Ni-Cu alloys ai 400 deg , at the rate of O.2%/sec for 2 and 12% expansion; and Ni-Al alloys at 700 deg , at ihe rate of O.2%/sec for 2 and 12% expansion and 2%/hour for 2%. The presence of copper and aluminum retards grain boundary shifting during high temperature deformation. (R.V.J.)

• Research Organization: Inst. of Metal Physics, Academy of Sciences, USSR
• NSA Number: NSA-14-000649
• OSTI ID: 4195306
• Journal Information: Fiz. Metal. i Metalloved, Journal Name: Fiz. Metal. i Metalloved Vol. Vol: 7
• Country of Publication: Country unknown/Code not available
• Language: Russian

Related Subjects

ALUMINUM ALLOYS
COPPER ALLOYS
DEFORMATION
EXPANSION
GRAIN BOUNDARIES
HIGH TEMPERATURE
MATERIALS TESTING
METALS, CERAMICS, AND MATERIALS
NICKEL ALLOYS
SOLID SOLUTIONS
TEMPERATURE
TENSILE PROPERTIES