THERMALLY STABLE SILICON-CONTAINING RESINS FOR DIELECTRIC APPLICATIONS. Quarterly Progress Report No. 2 for March 1-May 31, 1960
Technical Report
·
OSTI ID:4173936
Attempts were made to incoroorate p-phenylenebis(diethoxymethylsilane) and similar monomers into siliconcontaining polyraers by several methods. Simple hydrolysis procedures gave intractable materials with about the expected silicon content. The fluoro derivatives of several of these monomers, p- phenylenebis(difluoromethylsilane), p-phenylenebis(difluorophenylsilane), bis -p- (difluoromethylsilyl)phenyl ether, alpha ,p-bis(difluoromethylsilyl)toluene, and 1,6-hexamethylenebis(difluoromethylsilane) were prepared and characterized. Reactions of these compounds wlth aqueous sodium hydroxide and sodium salts of silanols are described. The incorporation of titanium groups into silicon- containing polymers has been investtgated in studies of the thermal stability of titanium monomers and the preparation of a prototype compound with the Si-O-Ti-O- Si group. For chelated titanium alkoxides prepared from acetylacetone, the decomposition products correspond to the product that would be expected from the alcoholysis of acetylacetone. The more stable 8-quinolinol derivative underwent very little decomposition at 200 deg . The prototype compound of the proposed polymer backbone, bis(8quinolinol)bis (dimethylphenylstloxy)titantum, was prepared in good yields either from the corresponding silicon acetate and titanium alkoxide at 150-180 deg or from the titanium chloride and the sodium silanolate in ether. (For preceding period see NP-8650.) (J.R.D.)
- Research Organization:
- Midwest Research Inst., Kansas City, Mo.
- NSA Number:
- NSA-14-021365
- OSTI ID:
- 4173936
- Report Number(s):
- NP-8930
- Country of Publication:
- United States
- Language:
- English
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