Redeposition of sputtered species during ion etching of Cu, Ag, and Au

Journal Article · Mon Sep 01 04:00:00 EDT 1975 · Journal of Vacuum Science and Technology

DOI:https://doi.org/10.1116/1.568467· OSTI ID:4140855

Miller, Alfred C.

The redeposition of sputtered Au,Ag, and Cu onto glass surfaces, which are in the same plane as bombarded metal foils, has been established by ion scattering spectrometry. Sites near the sputtering center were analyzed with sensitivities of 0.0008–0.001 monolayers after neon bombardmant of the foils for up to two hours. From the data, the redeposition coverage is estimated to be from 0.009₄ to 0.04₂ monolayers after two hours of Ne bombardment at 1500 eV. Finally, the electric field of the incident ion beam, acting on low-energy sputtered ions, is a likely cause of the redeposited material.

• Research Organization: Department of Physics and Institute of Colloid and Surface Science, Clarkson College of Technology, Potsdam, New York 13676
• Sponsoring Organization: USDOE
• NSA Number: NSA-33-001805
• OSTI ID: 4140855
• Journal Information: Journal of Vacuum Science and Technology, Journal Name: Journal of Vacuum Science and Technology Journal Issue: 5 Vol. 12; ISSN JVSTAL; ISSN 0022-5355
• Country of Publication: United States
• Language: English

Related Subjects

*COPPER-- SPUTTERING
*GOLD-- SPUTTERING
*SILVER-- SPUTTERING
*SPUTTERING-- ION SCATTERING ANALYSIS
640301* --Physics Research--Atomic
Molecular & Chemical Physics--Beams & Their Reactions
DEPOSITION
FOILS
HELIUM IONS
ION BEAMS
ION-ATOM COLLISIONS
N60100* --Physics (Atomic & Molecular)--Atomic
Electron
Ion & Molecular Beams & Reactions