Evaluation of a high-temperature adhesive for aerospace structural bonding
- Boeing Company, Seattle, WA (United States)
High-temperature polymeric adhesives are required for many new aerospace applications, and such adhesives must possess both processability for bonding as well as durability for elevated temperature service. Evaluation of one candidate adhesive, based on phenylethynyl terminated imide oligomers (PETI) developed at the NASA Langley Research Center, for titanium bonding is described here and includes a discussion of processing, and physical and mechanical properties. Mechanical testing included single lap shear, wedge-crack extension, climbing drum peel, and flatwise tension for honeycomb sandwich. Thermal aging with and without fluids was conducted for up to 5,000 hours for preliminary short term durability testing. Excellent processability and mechanical performance was obtained from PETI adhesive films, including adhesive films produced with production equipment in production scale batches. Processability and elevated temperature durability indicate that PETI resinbased adhesives are promising candidates for demanding high-temperature aerospace applications.
- OSTI ID:
- 412083
- Report Number(s):
- CONF-960310--; CNN: Contract NAS1-20013
- Country of Publication:
- United States
- Language:
- English
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