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Improvement of breakdown voltage in InGaP/InGaAs/GaAs heterostructure MESFETs for MMICs

Conference ·
OSTI ID:405391
; ;  [1]
  1. NTT LSI Lab., Kanagawa (Japan); and others

This paper describes the trade-off between breakdown voltage and RF performance of InGaP/InGaAs/GaAs heterostructure MESFETs for power amplifiers and oscillators in multi-function MMICs in the millimeter-wave range. The authors successfully improved both gate-drain and drain-source breakdown voltages while maintaining excellent high-frequency performance by using a double-layered gate consisting of WSiN with different nitrogen contents, and by varying epitaxial layer thickness and implantation dose.

OSTI ID:
405391
Report Number(s):
CONF-951097--
Country of Publication:
United States
Language:
English

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