FILM DEPOSITION USING ACCELERATED IONS
Technical Report
·
OSTI ID:4038817
A technique called Ion Plating'' is described which allows the formation of adherent films or coatings on metallic, semiconducting, or insulating substrates. The essential feature of the process is the ionization and acceleration of the depositing species by a gaseous discharge. The adherence of the deposits formed in this manner is excellent, even in those cases where conventional evaporation or electrodeposition techniques fail to provide adherent films. A discussion is given of the types of interfacial regions that may be formed during the film deposition and their influence on the adherence of the deposit. (auth)
- Research Organization:
- Sandia Lab., Albuquerque, N.Mex.
- DOE Contract Number:
- AT(29-1)-789
- NSA Number:
- NSA-18-018295
- OSTI ID:
- 4038817
- Report Number(s):
- SC-DR-281-63
- Country of Publication:
- United States
- Language:
- English
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