SMC curing simulation
- Takeda Chemical Ind., Ltd., Fujisawa, Kanagawa (Japan)
- Takeda Chemical Ind., Ltd., Yodogawa, Osaka (Japan)
SMC curing properties are being measured with many kinds of procedures all over the world, and they are the most important factors for molding. But, it is very difficult to predict SMC curing properties because SMC consists of many kinds of ingredients. Measuring temperature in the middle of SMC plies with a thermocouple is so convenient that it is widely adopted to curing properties evaluation. Time-temperature curve involves many factors, for example, thermal conductivity, radical generation and polymerization. SMC curing is affected by combination of these factors. The authors have built a simulation model for SMC curing consisting of seven physicochemical parameters. All parameters in this model can be calculated from time-temperature curves measured at two different molding temperatures. This model can simulate curing properties for any SMC formulations at any different molding temperatures. It can be used to simulate curing properties of molded parts even if parts have any thickness and shapes like ribs and bosses. This means molding can be simulated only using a few data. SMC curing properties can be easily predicted using this simulation program without real measurement. It greatly helps to optimize SMC curing properties and molding condition.
- OSTI ID:
- 392386
- Report Number(s):
- CONF-9602107--
- Country of Publication:
- United States
- Language:
- English
Similar Records
Simulation of SMC compression molding: Filling, curing, and volume changes
Cure characterization of thick polyester composite structures using dielectric and finite difference analysis