Cure characterization of thick polyester composite structures using dielectric and finite difference analysis
- Micromet Instruments Inc., Newton Centre, MA (United States)
Disposable and permanently mounted dielectric sensors were used to characterize the cure in polyester sheet molding compound (SMC) at various locations through the thickness of the part in a simulated molding environment. Using established techniques, the dielectric and temperature information were combined to yield local cure state information for each sensor. Parts under five millimeters thick were found to cure rather uniformly while parts greater than this had increasing degrees of nonuniformity in cure behavior through the thickness. These observed cure state data were compared to finite difference model predictions. The model predictions, which were confirmed by the sensor cure data, may be used to optimize part design and production by predicting the curing behavior and molding cycle time required for new structures.
- OSTI ID:
- 141920
- Report Number(s):
- CONF-930304--
- Country of Publication:
- United States
- Language:
- English
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