Monolithic microchannel heatsink
Patent
·
OSTI ID:372583
A silicon wafer has slots sawn in it that allow diode laser bars to be mounted in contact with the silicon. Microchannels are etched into the back of the wafer to provide cooling of the diode bars. To facilitate getting the channels close to the diode bars, the channels are rotated from an angle perpendicular to the diode bars which allows increased penetration between the mounted diode bars. This invention enables the fabrication of monolithic silicon microchannel heatsinks for laser diodes. The heatsinks have low thermal resistance because of the close proximity of the microchannels to the laser diode being cooled. This allows high average power operation of two-dimensional laser diode arrays that have a high density of laser diode bars and therefore high optical power density. 9 figs.
- Research Organization:
- University of California
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Univ. of California, Oakland, CA (United States)
- Patent Number(s):
- US 5,548,605/A/
- Application Number:
- PAN: 8-440,595
- OSTI ID:
- 372583
- Country of Publication:
- United States
- Language:
- English
Similar Records
Monolithic microchannel heatsink
Microchannel heatsinks for high average power laser diode arrays
Microchannel cooled heatsinks for high average power laser diode arrays
Patent
·
Sun Dec 31 23:00:00 EST 1995
·
OSTI ID:870579
Microchannel heatsinks for high average power laser diode arrays
Conference
·
Tue Dec 31 23:00:00 EST 1991
·
OSTI ID:10183080
Microchannel cooled heatsinks for high average power laser diode arrays
Conference
·
Thu Jan 14 23:00:00 EST 1993
·
OSTI ID:10166125