Microchannel cooled heatsinks for high average power laser diode arrays
Conference
·
OSTI ID:10166125
Detailed performance results for an efficient and low impedance laser diode array heatsink are presented. High duty factor and even cw operation of fully filled laser diode arrays at high stacking densities are enabled at high average power. Low thermal impedance is achieved using a liquid coolant and laminar flow through microchannels. The microchannels are fabricated in silicon using an anisotropic chemical etching process. A modular rack-and-stack architecture is adopted for heatsink design, allowing arbitrarily large two-dimensional arrays to be fabricated and easily maintained. The excellent thermal control of the microchannel heatsinks is ideally suited to pump army requirements for high average power crystalline laser because of the stringent temperature demands are required to efficiently couple diode light to several-nanometer-wide absorption features characteristic of lasing ions in crystals.
- Research Organization:
- Lawrence Livermore National Lab., CA (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 10166125
- Report Number(s):
- UCRL-JC--112678; CONF-930159--42; ON: DE93016533
- Country of Publication:
- United States
- Language:
- English
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