Active ester-cured-epoxy resins for electronic packaging
Conference
·
OSTI ID:370878
- Kanagawa Univ., Yokohama (Japan)
Epoxy resins cured with polyfunctional active esters have no pendent hydroxyl groups but pendent ester groups after cured. Epoxy resins without hydroxyl groups are expected to have high electric resistance, low dielectric constant and low hygroscopicity. These properties are desirable for electric and electronic applications. Thermal, viscoelastic, dielectric and hygroscopic properties are examined on the epoxy resins cured with active esters and compared with those of the resins cured with conventional curing agents and having pendent hydroxyl groups. As expected, these epoxy resins cured with active esters and having no hydroxyl groups possess low dielectric constant and low hygroscopicity, which are desirable for electronic packaging materials.
- OSTI ID:
- 370878
- Report Number(s):
- CONF-960376--
- Country of Publication:
- United States
- Language:
- English
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