Computational modeling of direct molten solder delivery for ball grid array applications
Computational modeling has been performed to determine optimum operational parameters for a piston-driven molten solder jetting device used to create array interconnects for BGA applications. The device is capable of delivering a 20 x 20 array of 600-800 {mu}m diameter molten 60Sn40Pb solder droplets onto an array of copper pads and primarily consists of an electromechanically driven piston, a heated reservoir, and an orifice plate. computer simulations were performed to determine the relationship between the amplitude and the rate of piston displacement, the onset of fluid ``pinch off``, and the production of satellite droplets. Results show that stable droplets are generated when the volume of the displaced fluid has a spherical diameter that is approximately equal to the orifice diameter.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 367006
- Report Number(s):
- SAND--96-1857C; CONF-9609212--2; ON: DE96006254
- Country of Publication:
- United States
- Language:
- English
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