Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Growth of epitaxial CoSi{sub 2} on SiGe(001)

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.370894· OSTI ID:355429
; ; ;  [1]
  1. Department of Physics and Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695 (United States)

A technique for achieving epitaxial growth of (001)-oriented CoSi{sub 2} on strained epitaxial layers of Si{sub 1{minus}x}Ge{sub x}(001) is described. The technique is based on a variation of the template method, and is designed to control the local environment of Co atoms at the CoSi{sub 2}/SiGe interface. The effects of the Co{endash}Ge interactions on the interfacial reaction and the epitaxial orientation and the morphology of the silicide film were investigated. This reaction was found to cause pitting in (001)-oriented CoSi{sub 2} films, and to stabilize the (22{ovr 1}) orientation for films codeposited under conditions where CoSi{sub 2}(001) growth is achieved on Si(001) substrates. The (22{ovr 1})-oriented CoSi{sub 2} films were islanded after annealing at 700thinsp{degree}C. The islands were terminated by ({ovr 1}11) and (110) facets inclined at 15.8{degree} and 19.5{degree}, respectively, from CoSi{sub 2} [22{ovr 1}] towards CoSi{sub 2} [114]. These results were interpreted in terms of reduction of interfacial and surface energies, and geometric effects. Silicide films up to 730-{Angstrom}-thick were deposited and annealed up to 900thinsp{degree}C. The films were stable against agglomeration, and retained tensile stress in the CoSi{sub 2} layer after annealing at 700thinsp{degree}C. The rms roughness of the CoSi{sub 2} films was comparable to that of the Si(001) substrate{emdash}less than 15 {Angstrom} over areas as large as 20{times}20 {mu}m{sup 2}. Films annealed at 900{degree}C were severely agglomerated. {copyright} {ital 1999 American Institute of Physics.}

OSTI ID:
355429
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 3 Vol. 86; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English

Similar Records

Film thickness effects in the CoSi{sub 1{minus}x}Ge{sub x} solid phase reaction
Journal Article · Thu Oct 01 00:00:00 EDT 1998 · Journal of Applied Physics · OSTI ID:659298

Growth of CoSi{sub 2} on Si(001) by reactive deposition epitaxy
Journal Article · Mon Feb 14 23:00:00 EST 2005 · Journal of Applied Physics · OSTI ID:20668212

Structure and epitaxy studies of cobalt silicide/silicon heterostructures
Thesis/Dissertation · Mon Dec 31 23:00:00 EST 1990 · OSTI ID:7109507