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Title: A three-axis micromachined accelerometer with a CMOS position-sense interface and digital offset-trim electronics

Journal Article · · IEEE Journal of Solid-State Circuits
DOI:https://doi.org/10.1109/4.753678· OSTI ID:343674
;  [1]
  1. Univ. of California, Berkeley, CA (United States)

This paper describes a three-axis accelerometer implemented in a surface-micromachining technology with integrated CMOS. The accelerometer measures changes in a capacitive half-bridge to detect deflections of a proof mass, which result from acceleration input. The half-bridge is connected to a fully differential position-sense interface, the output of which is used for one-bit force feedback. By enclosing the proof mass in a one-bit feedback loop, simultaneous force balancing and analog-to-digital conversion are achieved. On-chip digital offset-trim electronics enable compensation of random offset in the electronic interface. Analytical performance calculations are shown to accurately model device behavior. The fabricated single-chip accelerometer measures 4 {times} 4 mm{sup 2}, draws 27 mA from a 5-V supply, and has a dynamic range of 84, 81, and 70 dB along the x-, y-, and z-axes, respectively.

Sponsoring Organization:
Sandia National Labs., Albuquerque, NM (United States); Defense Advanced Research Projects Agency, Arlington, VA (United States)
OSTI ID:
343674
Journal Information:
IEEE Journal of Solid-State Circuits, Vol. 34, Issue 4; Other Information: PBD: Apr 1999
Country of Publication:
United States
Language:
English