Materials processing with atmospheric-pressure plasma jets

Conference · Wed Dec 30 23:00:00 EST 1998

OSTI ID:343589

Hicks, R; Jeong, J; Babayan, S; Schuetze, A ^[1]; Park, J; Herrmann, H; Henins, I; Selwyn, G ^[2]

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1. Univ. of California, Los Angeles, CA (United States). Chemical Engineering Dept.
2. Los Alamos National Lab., NM (United States). Plasma Physics Div.

Atmospheric-pressure plasma jets can be used for a wide range of materials processing applications, including surface cleaning and modification, selective etching, and thin-film deposition. The plasma source consists of two closely spaced electrodes through which helium and other gases flow (O{sub 2}, CF{sub 4}, etc.). A variety of electrode configurations can be used, and the source is suitable for continuous and large-area processing of materials. Another advantage of the plasma jet is that it achieves etching and deposition rates that are higher than those obtained in low-pressure plasmas. At the meeting, the plasma source will be described in detail, and results for several materials processing applications will be presented.

• OSTI ID: 343589
• Report Number(s): CONF-980601--
• Country of Publication: United States
• Language: English

Related Subjects

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
36 MATERIALS SCIENCE
ATMOSPHERIC PRESSURE
DESIGN
ETCHING
MATERIALS
PLASMA JETS
SURFACE CLEANING
SURFACE COATING
SURFACE TREATMENTS