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Static grain growth in a microduplex Ti-6Al-4V alloy

Journal Article · · Acta Materialia
 [1]; ;  [2];  [3]
  1. Central Washington Univ., Ellensburg, CA (United States). Industrial Engineering Technology Dept.
  2. Washington State Univ., Pullman, WA (United States). School of Mechanical and Materials Engineering
  3. Lawrence Livermore Lab., CA (United States)
The grain growth behavior of the microduplex titanium, 6% aluminum, 4% vanadium alloy is addressed. Although there has been considerable work done on second phase particle coarsening, there is limited research on coarsening in a two-phase material with nearly equal phase ratios. In this study, coarsening parameters were determined for the temperature range of 850--925 C, where {alpha} and {beta} phase ratios are approximately 50%. Experimentally determined grain growth data for the Ti alloy are found to follow classical particle-stabilized grain growth kinetics with a temperature dependent coefficient and a constant exponent. On the basis of these observations a grain boundary pipe diffusion model is proposed which has the desired features of incorporating both the faster kinetics of the grain boundary diffusion and the unidirectional exponent q = 5, which is often observed in microduplex alloys. The model appears to resolve a previously reported dilemma that the time exponent suggests pipe diffusion but the kinetics associated with the triple boundary is too slow. The concept proposed should have applicability to other two-phase alloys containing approximately equal volume fractions of each phase.
Sponsoring Organization:
USDOE, Washington, DC (United States)
OSTI ID:
328267
Journal Information:
Acta Materialia, Journal Name: Acta Materialia Journal Issue: 1 Vol. 47; ISSN 1359-6454; ISSN ACMAFD
Country of Publication:
United States
Language:
English

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