Static grain growth in a microduplex Ti-6Al-4V alloy
Journal Article
·
· Acta Materialia
- Central Washington Univ., Ellensburg, CA (United States). Industrial Engineering Technology Dept.
- Washington State Univ., Pullman, WA (United States). School of Mechanical and Materials Engineering
- Lawrence Livermore Lab., CA (United States)
The grain growth behavior of the microduplex titanium, 6% aluminum, 4% vanadium alloy is addressed. Although there has been considerable work done on second phase particle coarsening, there is limited research on coarsening in a two-phase material with nearly equal phase ratios. In this study, coarsening parameters were determined for the temperature range of 850--925 C, where {alpha} and {beta} phase ratios are approximately 50%. Experimentally determined grain growth data for the Ti alloy are found to follow classical particle-stabilized grain growth kinetics with a temperature dependent coefficient and a constant exponent. On the basis of these observations a grain boundary pipe diffusion model is proposed which has the desired features of incorporating both the faster kinetics of the grain boundary diffusion and the unidirectional exponent q = 5, which is often observed in microduplex alloys. The model appears to resolve a previously reported dilemma that the time exponent suggests pipe diffusion but the kinetics associated with the triple boundary is too slow. The concept proposed should have applicability to other two-phase alloys containing approximately equal volume fractions of each phase.
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- OSTI ID:
- 328267
- Journal Information:
- Acta Materialia, Journal Name: Acta Materialia Journal Issue: 1 Vol. 47; ISSN 1359-6454; ISSN ACMAFD
- Country of Publication:
- United States
- Language:
- English
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