Kinetic aspects of the grain boundary segregation in Cu(Bi) alloys
- Max-Planck-Inst fuer Metallforschung, Stuttgart (Germany)
- Technion-Israel Inst. of Tech., Haifa (Israel). Dept. of Materials Engineering
The kinetics of grain boundary segregation in Cu(Bi) alloys has been studied at temperatures of 600 and 850 C by Auger electron spectroscopy. A substantial acceleration of the grain boundary segregation kinetics in the two-phase area of the Cu-Bi phase diagram is observed. To explain this acceleration, a model of dislocation diffusion is proposed. In the framework of the model, the accelerated kinetics of grain boundary segregation in the two-phase area of the Cu-Bi phase diagram results from the microscopic pipe-like precipitation of a Bi-rich liquid phase along the dislocation cores. The dislocation diffusivities are estimated and two kinds of diagrams of the segregation kinetics are constructed.
- OSTI ID:
- 684395
- Journal Information:
- Acta Materialia, Journal Name: Acta Materialia Journal Issue: 10 Vol. 47; ISSN 1359-6454; ISSN ACMAFD
- Country of Publication:
- United States
- Language:
- English
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