Lapping slurry
Patent
·
OSTI ID:321263
Improved lapping slurries provide for easier and more thorough cleaning of alumina work pieces, as well as inhibit corrosion of the lapping table and provide for easier cleaning of the lapping equipment. The unthickened lapping slurry comprises abrasive grains such as diamond abrasive dispersed in a carrier comprising water, glycerine, and triethanolamine. The thickened lapping slurry comprises abrasive grains such as diamond abrasive dispersed in a carrier comprising water, glycerine, triethanolamine, a water soluble silicate, and acid. 1 fig.
- Research Organization:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC05-84OR21400
- Assignee:
- Lockheed Martin Energy Systems, Inc., Oak Ridge, TN (United States)
- Patent Number(s):
- US 5,855,633/A/
- Application Number:
- PAN: 8-870,572
- OSTI ID:
- 321263
- Resource Relation:
- Other Information: PBD: 5 Jan 1999
- Country of Publication:
- United States
- Language:
- English
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