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Development and testing of an active platen for IC manufacturing

Conference ·
OSTI ID:310021
The conflicting demands for finer features and increased production rates in integrated circuit manufacturing have emphasized the need for improved wafer positioning technology. In this paper we present operational test results from a magnetically levitated platen with structurally integrated piezoelectric acctuators. The strain based actuators provide active damping of the platen`s flexible body modes, enabling increased bandwidth on the mag-lev positioning system. Test results reveal a dramatic reduction in steady state positioning error and settling time through implementation of active vibration control.
Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
310021
Report Number(s):
SAND--98-1635C; CONF-980938--; ON: DE99000589; BR: DP0102011
Country of Publication:
United States
Language:
English

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