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Title: Microfabricated silicon gas chromatographic micro-channels: fabrication and performance

Abstract

Using both wet and plasma etching, we have fabricated micro-channels in silicon substrates suitable for use as gas chromatography (GC) columns. Micro-channel dimensions range from 10 to 80 {micro}m wide, 200 to 400 {micro}m deep, and 10 cm to 100 cm long. Micro-channels 100 cm long take up as little as 1 cm{sup 2} on the substrate when fabricated with a high aspect ratio silicon etch (HARSE) process. Channels are sealed by anodically bonding Pyrex lids to the Si substrates. We have studied micro-channel flow characteristics to establish model parameters for system optimization. We have also coated these micro-channels with stationary phases and demonstrated GC separations. We believe separation performance can be improved by increasing stationary phase coating uniformity through micro-channel surface treatment prior to stationary phase deposition. To this end, we have developed microfabrication techniques to etch through silicon wafers using the HARSE process. Etching completely through the Si substrate facilitates the treatment and characterization of the micro- channel sidewalls, which domminate the GC physico-chemical interaction. With this approach, we separately treat the Pyrex lid surfaces that form the top and bottom surfaces of the GC flow channel.

Authors:
; ; ; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Org.:
USDOE Office of Financial Management and Controller, Washington, DC (United States)
OSTI Identifier:
310020
Report Number(s):
SAND-98-1947C; CONF-980918-
ON: DE99000546; BR: YN0100000
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Micromachining and microfabrication symposium, Santa Clara, CA (United States), 21-22 Sep 1998; Other Information: PBD: [1998]
Country of Publication:
United States
Language:
English
Subject:
44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; GAS CHROMATOGRAPHY; SILICON; FABRICATION; PERFORMANCE; ETCHING

Citation Formats

Matzke, C M, Kottenstette, R J, Casalnuovo, S A, Frye-Mason, G C, Hudson, M L, Sasaki, D Y, Manginell, R P, and Wong, C C. Microfabricated silicon gas chromatographic micro-channels: fabrication and performance. United States: N. p., 1998. Web.
Matzke, C M, Kottenstette, R J, Casalnuovo, S A, Frye-Mason, G C, Hudson, M L, Sasaki, D Y, Manginell, R P, & Wong, C C. Microfabricated silicon gas chromatographic micro-channels: fabrication and performance. United States.
Matzke, C M, Kottenstette, R J, Casalnuovo, S A, Frye-Mason, G C, Hudson, M L, Sasaki, D Y, Manginell, R P, and Wong, C C. Sun . "Microfabricated silicon gas chromatographic micro-channels: fabrication and performance". United States. https://www.osti.gov/servlets/purl/310020.
@article{osti_310020,
title = {Microfabricated silicon gas chromatographic micro-channels: fabrication and performance},
author = {Matzke, C M and Kottenstette, R J and Casalnuovo, S A and Frye-Mason, G C and Hudson, M L and Sasaki, D Y and Manginell, R P and Wong, C C},
abstractNote = {Using both wet and plasma etching, we have fabricated micro-channels in silicon substrates suitable for use as gas chromatography (GC) columns. Micro-channel dimensions range from 10 to 80 {micro}m wide, 200 to 400 {micro}m deep, and 10 cm to 100 cm long. Micro-channels 100 cm long take up as little as 1 cm{sup 2} on the substrate when fabricated with a high aspect ratio silicon etch (HARSE) process. Channels are sealed by anodically bonding Pyrex lids to the Si substrates. We have studied micro-channel flow characteristics to establish model parameters for system optimization. We have also coated these micro-channels with stationary phases and demonstrated GC separations. We believe separation performance can be improved by increasing stationary phase coating uniformity through micro-channel surface treatment prior to stationary phase deposition. To this end, we have developed microfabrication techniques to etch through silicon wafers using the HARSE process. Etching completely through the Si substrate facilitates the treatment and characterization of the micro- channel sidewalls, which domminate the GC physico-chemical interaction. With this approach, we separately treat the Pyrex lid surfaces that form the top and bottom surfaces of the GC flow channel.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {11}
}

Conference:
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