Theoretical analysis of faceted void dynamics in metallic thin films under electromigration conditions
Conference
·
OSTI ID:305572
- Univ. of California, Santa Barbara, CA (United States). Dept. of Chemical Engineering
A theoretical analysis is presented of the electromigration-induced dynamics of transgranular voids in metallic thin films. The analysis is based on self-consistent dynamic simulations of current-driven void surface propagation coupled with the distribution of the electric field in the metallic film. The simulation predictions highlight the rich nonlinear dynamics of current-driven evolution of voids that become faceted due to the strongly anisotropic nature of surface diffusion. The numerical results are analyzed based on approximate analytical solutions to faceted void migration and a linearized theory for the morphological stability of planar void facets.
- Sponsoring Organization:
- National Science Foundation, Washington, DC (United States); California Univ., Berkeley, CA (United States); Los Alamos National Lab., NM (United States)
- OSTI ID:
- 305572
- Report Number(s):
- CONF-980405--
- Country of Publication:
- United States
- Language:
- English
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