Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opals Structures
- Stanford University
- National Renewable Energy Lab., Golden, CO (United States)
- University of California, Merced
- Toyota
- Hyundai Motor Group
- Chung-Ang University
Engineered microporous structures have received much attention in high-heat-flux electronics cooling due to their high thermal conductivity and permeability, and large surface area for heat transfer, but are susceptible to boiling-induced thermal degradation. This study investigates the efficacy of nickel inverse opals (NiIOs) in mitigating structural degradation caused by corrosion-assisted erosion during pool boiling with water as the working fluid. First, we compared the reliability of NiIOs to copper inverse opals (CuIOs) for a 3-day pool boiling test at constant heat flux. The NiIOs demonstrated superior resistance to thermal degradation due to their inherent corrosion resistance and mechanical strength. Subsequently, we conducted a more controlled experiment to show the effect of heat flux on the degradation of the NiIOs while excluding the effect of temperature variations. Pool boiling tests of 20-..mu..m-thickness NiIOs covering an area of ~11 x 11 mm2 with a 2.5 x 2.5 mm2 heater at the center were conducted at heat flux levels of 20%, 40%, and 60% of the critical heat flux (CHF) for 3 days. The NiIOs subjected to heat flux levels of 20% and 40% CHF showed minimal degradation, while the sample subjected to 60% CHF showed erosion on the top surface due to higher bubble formation and departure rate. These results show the potential of NiIOs as a promising solution for long-term thermal management in high-power electronic devices, although design considerations for maximum allowable heat flux are necessary for reliable operation.
- Research Organization:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- Sponsoring Organization:
- USDOE Advanced Research Projects Agency - Energy (ARPA-E)
- DOE Contract Number:
- AC36-08GO28308
- OSTI ID:
- 3011910
- Report Number(s):
- NREL/JA-5700-93471
- Journal Information:
- Journal of Electronic Packaging, Journal Name: Journal of Electronic Packaging Journal Issue: 4 Vol. 147
- Country of Publication:
- United States
- Language:
- English
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