Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Pool Boiling Reliability Tests and Degradation Mechanisms of Microporous Copper Inverse Opal (CuIOs) Structures

Conference ·

The rising power density in electronic systems requires thermal management solutions that are both high-performing and reliable. Porous materials such as Copper Inverse Opal (CuIOs) have unique structural features, including high permeability and high thermal conductivity, to enhance pool boiling performance. However, there is little understanding of the degradation mechanism of such porous materials under pool boiling conditions. In this study, samples of 10 ..mu..m thick CuIOs with 4.8 ..mu..m diameter, covering silicon substrate of area 11 mm x 11 mm, with various heated areas ranging from 2.5 mm x 2.5 mm to 10 mm x 10 mm, were tested in 100 degrees C deionized water at a constant heat flux of 110 Wcm -2 for 3-to-7 days. The combined effect of erosion and corrosion caused structural degradation of the CuIOs. The directly heated area had the most severe degradation while the edge of the heater and the unheated area showed progressively less degradation, maintaining some CuIOs structure even after the 7-day reliability test. Among all the tested samples with various heater sizes, the 2.5 mm x 2.5 mm heater sample - in which the heater size was designed to be comparable to the water bubble characteristic length - had the largest critical heat flux (CHF) up to 300 Wcm -2 with a superheat ~ 13 degrees C. Additionally, CuIOs with a smaller heated area performed better in terms of reliability. This study offers preliminary insights into CuIOs degradation mechanisms, contributing to the development of more robust thermal management solutions. We expect that electroless plating of CuIOs with gold (Au), nickel (Ni), and atomic layer deposition (ALD) aluminum oxide (Al 2 O 3 ) in combination with appropriate application-specific coolants will further improve the reliability and lifetime of the CuIOs.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE Advanced Research Projects Agency - Energy (ARPA-E)
DOE Contract Number:
AC36-08GO28308
OSTI ID:
2477750
Report Number(s):
NREL/CP-5400-92116; MainId:93894; UUID:c3fe311a-b58a-45a9-9fe7-99f831ca140b; MainAdminId:74280
Country of Publication:
United States
Language:
English

References (13)

Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications
  • Zhang, Chi; Rong, Guoguang; Palko, James W.
  • Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales https://doi.org/10.1115/IPACK2015-48262
conference July 2015
Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications journal July 2021
Boiling-induced thermal degradation of copper inverse opals and its mitigation journal February 2024
On the Inertia of Future More-Electronics Power Systems journal December 2019
Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper journal October 2017
Enhanced Capillary-Fed Boiling in Copper Inverse Opals via Template Sintering journal August 2018
Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement conference May 2014
Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments
  • Kekelia, Bidzina; Wu, Qianying; Narumanchi, Sreekant
  • ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems https://doi.org/10.1115/IPACK2023-113781
conference October 2023
Tailoring Permeability of Microporous Copper Structures through Template Sintering journal August 2018
The effect of temperature on the reliability of electronic components conference January 2014
Survey of High-Temperature Reliability of Power Electronics Packaging Components journal May 2015
Increasing Boiling Heat Transfer using Low Conductivity Materials journal August 2015
Enhanced heat transfer using wafer-scale crack-free well-ordered porous structure surface journal November 2023