Molecular dynamics simulation of high strain-rate void nucleation and growth in copper
- University of California, Lawrence Livermore National Laboratory, Livermore, California 94550 (United States)
Isotropic tension is simulated in nanoscale polycrystalline copper with 10nm grain size using molecular dynamics. The nanocrystalline copper is fabricated on the computer by growing randomly oriented grains from seed sites in the simulation cell. Volume strain rates of 10{sup 8}{minus}10{sup 10} are considered for systems ranging from 10{sup 5}{minus}10{sup 6} atoms using an EAM potential for copper. The spacing between voids for room temperature single crystal simulations is found to scale approximately as l{approximately}0.005C{sub s}/{gamma}, where C{sub s} is the sound speed and {gamma} is the strain rate. Below strain rates of about 10{sup 9}, only one void is observed to nucleate and in the polycrystalline simulation cell. {copyright} {ital 1998 American Institute of Physics.}
- Research Organization:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 295459
- Report Number(s):
- CONF-970707-; ISSN 0094-243X; TRN: 99:001692
- Journal Information:
- AIP Conference Proceedings, Vol. 429, Issue 1; Conference: Meeting of the topical group on shock compression of condensed matter of the American Physical Society, Amherst, MA (United States), 27 Jul - 1 Aug 1997; Other Information: PBD: Jul 1998
- Country of Publication:
- United States
- Language:
- English
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