Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Ion beam induced charge (IBIC) imaging for the failure analysis of multi-level metal VLSI circuits

Book ·
OSTI ID:260495

The authors report a new contract mechanism observed in ion beam induced charge images (IBIC) obtained with a focused proton beam of 2 MeV energy. Proton beams of 2 MeV energy can penetrate nearly 50 {micro}m into silicon thus accessing active areas which are otherwise inaccessible with the conventional Electron Beam Induced Current (EBIC) method. EBIC and IBIC images of devices are compared. IBIC images show contrast of unconnected junctions without contrast degradation due to the intervening metal layers.

OSTI ID:
260495
Report Number(s):
CONF-951156--; ISBN 0-87170-554-0
Country of Publication:
United States
Language:
English

Similar Records

The influence of ion induced damage on lateral charge collection and IBIC image contrast
Conference · Fri Aug 01 00:00:00 EDT 1997 · OSTI ID:510425

IBIC characterization of charge transport in CdTe:Cl
Journal Article · Sun Apr 15 00:00:00 EDT 2007 · Semiconductors · OSTI ID:21088090

Effect of crystal defects on minority carrier diffusion lengths on 6H SiC
Book · Tue Dec 30 23:00:00 EST 1997 · OSTI ID:304420